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半導体設備関連 > 後工程装置 > ボンダーの検索結果

Showing 4 of1 - 4 hits

Control No. Product Name Model Manufacturer Year Details Contact
180216-001~009 Wire bonder UTC-2000Super SHINKAWA 2007

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180511-008 Die Bonde BESTEM-D10sp CANON MACHINERY 2011

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190522-002 Flip Chip Bonder AFM-15 TDK 2016

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170415-010 Wire Bonder ACB-3000 shinkawa 2011

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Showing 4 of1 - 4 hits

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