Hightec Systems has a wide selection of used products such as semiconductor facilities, LCD and FPD related equipment
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半導体設備関連 > 後工程装置 > ボンダーの検索結果
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Control No.
Product Name
Model
Manufacturer
Year
Details
Contact
180216-001～009
Wire bonder
UTC-2000Super
SHINKAWA
2007
詳細
Contact us
180511-008
Die Bonde
BESTEM-D10sp
CANON MACHINERY
2011
詳細
Contact us
190522-002
Flip Chip Bonder
AFM-15
TDK
2016
詳細
Contact us
170415-010
Wire Bonder
ACB-3000
shinkawa
2011
詳細
Contact us
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