Hightec Systems has a wide selection of used products such as semiconductor facilities, LCD and FPD related equipment
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半導体設備関連 > 後工程装置 > ボンダーの検索結果
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Control No.
Product Name
Model
Manufacturer
Year
Details
Contact
180511-008
Die Bonde
BESTEM-D10sp
CANON MACHINERY
2011
詳細
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180617-001
Wire Bonder
ACB-3000
SHINKAWA
2009
詳細
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180617-002
Wire Bonder
ACB-3000
SHINKAWA
2010
詳細
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180617-003
Wire Bonder
ACB-3000
SHINKAWA
2009
詳細
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180617-004
Wire Bonder
ACB-3000
SHINKAWA
2009
詳細
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180918-1-001
MANUAL WEDGE WIRE BONDER
D7476
WEST・BOND
詳細
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190505-001
Soft Solder Die Bonder
BESTEM-D03Hp
CANON MACHINERY INC.
2014
詳細
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