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半導体設備関連 > 後工程装置 > ボンダーの検索結果

Showing 7 of1 - 7 hits

Control No. Product Name Model Manufacturer Year Details Contact
180511-008 Die Bonde BESTEM-D10sp CANON MACHINERY 2011

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180617-001 Wire Bonder ACB-3000 SHINKAWA 2009

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180617-002 Wire Bonder ACB-3000 SHINKAWA 2010

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180617-003 Wire Bonder ACB-3000 SHINKAWA 2009

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180617-004 Wire Bonder ACB-3000 SHINKAWA 2009

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180918-1-001 MANUAL WEDGE WIRE BONDER D7476 WEST・BOND

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190505-001 Soft Solder Die Bonder BESTEM-D03Hp CANON MACHINERY INC. 2014

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Showing 7 of1 - 7 hits

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